Research
MLI focuses on the development of ultra-high purity process chemicals for the semiconductor wafer fabrication, silicon wafer production, LCD production, through Silicon Via (TSV) and packaging industries.
MLI is developing a suite of high precision advanced metallization chemicals used for Cu electrolytic and electroless plating applications. This technology includes advanced high purity electrolytes (VMS); 32nm and beyond additives that includes accelerators, suppressors and levelers; advanced Plate on Barrier material; and a series of leading TSV chemicals.
The attributes include superior fill rate and uniformity across wide trench and via arrays, low post ECD and post CMP defectivity, exceptionally wide process latitude, excellent leveling (over plating), and minimum over burden. We can achieve extremely smooth films surface roughness as dictated by a customer integration schemes. These materials have the highest purity, tightest tolerances, are designed for superior productivity, and designed for advanced device extendibility. The most advanced products extend from 90nm through 22nm. We have customers working below 22nm with our most innovative products.
With our Tama Pure materials we have a class of ICP-MS reagents with guaranteed metallic impurity levels at <10PPT. They are available for Ammonium Hydroxide, Hydrofluoric Acid, Hydrochloric Acid, Sulfuric Acid, Nitric Acid, Hydrogen Peroxide, and Ultrapure Water.
We have extensive collaboration programs with all the major electroplating platform suppliers, research consortiums throughout the world, and university programs for the most advanced materials development.
Our advanced research in the TMAH class of materials resulted in TMAH-based developers via an entirely sealed, fully integrated facility connected directly to a TMAH refinery. This resulted in precision, quality and value unsurpassed in the industry. Our impurity metals, carbonate and chloride levels are the industry leading benchmark.
We also developed an additional line of advanced cleaning and etching solutions for pre and post deposition treatments and Co capping for EM enhancement.
