PRODUCT APPLICATIONS
MLI is a specialty chemical manufacturer focusing on the development and production of ultra-high purity process chemicals for the semiconductor wafer fabrication, silicon wafer production, LCD production, Through Silicon Via (TSV) and packaging industries.
Our tetramethyl ammonium hydroxide (TMAH) class of materials exhibits purity, precision, quality, and value unsurpassed in the industry. We are the technology leader in these materials. The TMAH class is available with and without surfactant at specified concentrations of choice. We offer metals, carbonate and chloride levels lower than any producer. We have a suite of ultrapure reagents for metrology analyses and calibrations.
We also have an additional line of advanced cleaning and etching solutions for pre and post deposition treatments, CoWP “enabling” materials, and particle minimization materials.
MLI is also developing a suite of high-precision, advanced metallization chemicals used for Cu electrolytic and electroless plating applications. This technology includes advanced damascene high purity electrolytes (VMS); 32nm and beyond additives including accelerators, suppressors and levelers, and advanced Plate on Barrier materials; and a series of TSV plating materials. We also offer additives for redistribution layer and bump plating. We have materials appropriate for applications on NEXX, Novellus, AMAT and Ebara platforms. MLI customizes organic additives and VMS for specific customer needs which include desired purity, tightest tolerance, superior productivity, advanced device extendibility, and preferred process flow.
The attributes include superior fill rate and uniformity across wide trench and via arrays, low post ECD and post CMP defectivity, exceptionally wide process latitude, excellent leveling (over plating), and minimum over burden. We can achieve extremely smooth films surface roughness as dictated by a customer integration schemes. These materials have the highest purity, tightest tolerances, are designed for superior productivity, and designed for advanced device extendibility. The most advanced products extend from 90nm through 22nm and beyond.
With our Tama Pure materials we have a class of ICP-MS reagents with guaranteed metallic impurity levels at <10PPT. They are available for Ammonium Hydroxide, Hydrofluoric Acid, Hydrochloric Acid, Sulfuric Acid, Nitric Acid, Hydrogen Peroxide, and Ultrapure Water.
We have available additional Customized Bulk Chemical Blending and laboratory capability to support production and quality control of customized chemical products.
These materials are available from redundant facilities among the USA, China, Japan, Korea, Taiwan and Singapore to ensure supply continuity.
All equipment systems and processes used by MLI and its affiliates are custom-designed and engineered internally to maintain and improve chemistry purity and consistency. Over the last eight years MLI has earned technology and quality awards from the largest chip maker in the world. We have extensive collaboration programs with all the major electroplating platform suppliers, research consortiums throughout the world, and university programs for the most advanced materials development.
