Products

Copper Plating Additives

Proprietary additives that exhibit exceptionally wide process latitude for manufacturing and yield optimization. Key attributes include superior fill rate and uniformity across wide trench and via arrays, low post ECD and post CMP defectivity, excellent leveling (over plating), and minimum over burden. The materials achieve extremely smooth films surface roughness as dictated by customer integration schemes. These materials have the highest purity, tightest tolerances, are designed for superior productivity, and designed for advanced device extendibility. The most advanced products extend from 90nm through 22nm and beyond.

Moses Lake Industries (MLI) is rapidly becoming the leading advanced technology supplier of materials to the Semiconductor Industry for wafer fabrication, packaging, and through silicon via applications. The MLI fundamental approach involves vertically integrated research and development, production of materials in the most advanced manufacturing facilities, and achieves unmatched quality and precision. This fully integrated approach enables MLI to deliver the lowest cost of ownership and highest value products to our customers.

8248 Randolph Road NE
Moses Lake, Washington 98837
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Main: 509. 762.5336
Fax: 509. 762.5981