Minimizing customers' overall Cost of Ownership is a key part of Moses Lake Industries' product development goal. With feature heights
exceeding 100µm and aspect ratios up to 1:10, metallization processes for bumps, MEMS, and 3D packaging require chemistries that
allow low cost, rapid plating of features with the proper dimension with consistent uniformity and smooth morphology.
BASELINE BUMP ADDITIVES 4 µm/min plating
The resulting features are smooth, and uniform in shapes and sizes.
MLI is developing high speed (> 6 mm/min) bump plating chemistries and processes for producing features with aspect ratios > 1 that
are smooth as well as uniform in shapes and sizes, and without dendrites. Good within die uniformity and total indicated run-out will also be achieved.
For more information on our bump plating products, please contact us.
Mission
VERTICAL LINE BUMP ADDITIVES
